MicroSlitter
For narrow cuts, thinnest films and numerous applications
The KAMPF Microslitter slits a wide variety of films perfectly to narrow widths. The technological features of this special machine make it possible for you to fully meet product specifications. The comprehensive performance spectrum ranges from conventional converting applications to the processing of new materials used in modern technologies. This results in products of the highest quality with minimum manufacturing tolerances.
The Microslitter impresses with its stable machine concept, compact design, excellent roll arrangement for special material paths and state-of-the-art drive and slitting technology. The modular structure provides an individual design for your application.
- Metallized films
- Ultra thin metallized films
- Converting applications
- BSF applications
Technical Data MicroSlitter Line
| Thin metallized films Thin films e.g. made of BOPP, BOPET | Converting applications BSF applications | Ultra thin metallized films BOPP, BOPET | |
| Material thickness: | 1.6 µm - 16 µm | 10 µm - 250 µm | 1.4 - 4 µm |
| Material width: | max. 1,000 mm | max. 1,300 mm | max. 650 mm |
| Parent roll diameter: | max. 600 mm | max. 800 mm | 600 mm |
| Finished roll diameter: | max. 350 mm | max. 350 mm | max. 350 mm |
| Slitting system: | Blade cut, wave cut | Blade cut, scissors cut | blade cut, wave cut |
| Slitting width: | > 4.5 mm straight cut | ≥ 4,5 mm blade cut | > 4.5 mm |
| > 9 mm wave cut | ≥ 5 scissors cut | ||
| Machine speed: | max. 700 m/min | max. 500 m/min | max. 700 m/min |
